5.1.1 Hole Spacing
Figure 31: Spacing requirements for holes and vias
 The spacing between holes must satisfy B 5mil.
 The spacing between holes and any copper trace/pour must satisfy: B1 & B2 5mil.
 The spacing between plated through holes (PTH) to the board edge: B3 20mil.
 The recommended minimum distance from non-plated through holes (NPTH) wall to the board edge is D
5.1.2 Via hole banned layout area
 Via holes must not overlap solder pads.
 Via holes must not be in a region that extends 1.5mm from the metal shell of any components.
5.2 Mechanical Hole Design
5.2.1 Hole Types
Table 5: Recommended hole designs according to function
Figure 32: Structure of mechanical holes.
5.2.2 Spacing Requirements
Table 6: Spacing requirements for mechanical holes according to type.