Appendix – PCB DFM 14
Extracted from the Seeed Fusion Design for Manufacture (DFM) publication, this tid-bit of information is often missed when describing electronic devices. Are my boards double …
Posts in category PCB Design for Manufacture
Files for Manufacture Requirements – PCB DFM 13
13.1 Naming Requirements for Assembly Files [108] Requires board name, version, panelization description and version information. 13.2 Naming Requirements for Stencil Layout Files [109] Requires …
Surface Treatment – PCB DFM 12
12.1 Hot Air Solder Leveling (HASL) 12.1.1 Process Requirements [103] The PCB is covered with molten tin-silver alloy and the excess is blown off using …
Fiducial Mark Structure – PCB DFM 11
11.2.1 Panel Fiducial Marks and Image Fiducial Marks [97] Size/Shape: a solid filled circle with a diameter of 1.0 mm. Solder mask opening: 2.00mm in …
PCB Dimensions Specification – PCB DFM Part 10
10.1 Manufactured PCB Dimensions[90] The range of dimensions allowed for each type of PCB construction is shown in table 11. Figure 55: PCB dimensions description.Table …
PCB Lamination Structure – PCB DFM Part 9
Layer Structure [86]The foil stacking structure is recommended. Description: For PCB lamination, there are generally two design types: Copper foil structure and Core board structure. …
Silkscreen Design – PCB DFM Part 8
8.1 Silkscreen Design Considerations [77] General Requirements The width of the silkscreen line should be greater than 5mil. Designers must ensure that the silkscreen character’s …
FREE PCB DFM Manual V1.1 Available In Seeed Fusion
Dear Fusion Users, Thank you for all your feedback. We are pleased to announce that the new Design for Manufacture Version 1.1 is now available …