{"id":131303,"date":"2026-08-07T08:36:54","date_gmt":"2026-08-07T08:36:54","guid":{"rendered":"https:\/\/www.seeedstudio.com\/blog\/?p=131303"},"modified":"2026-08-07T08:41:50","modified_gmt":"2026-08-07T08:41:50","slug":"seeed-fusion-what-pcb-base-materials-does-seeed-fusion-offer-and-which-one-should-you-choose","status":"publish","type":"post","link":"https:\/\/www.seeedstudio.com\/blog\/2026\/08\/07\/seeed-fusion-what-pcb-base-materials-does-seeed-fusion-offer-and-which-one-should-you-choose\/","title":{"rendered":"What PCB Base Materials Does Seeed Fusion Offer \u2014 and Which One Should You Choose?"},"content":{"rendered":"\n<figure class=\"wp-block-image\"><img decoding=\"async\" src=\"https:\/\/seeedstudio.feishu.cn\/space\/api\/box\/stream\/download\/asynccode\/?code=NTE2YzA3NjBjYTI3YzkwZmUzODdhM2UyM2NmMTQ1ZGJfYkJOY2RnTEFmR010OG1ZSk1VS1NEZmpBaUUzZFl0bTRfVG9rZW46SzRNTWJtOGhqb2Q0QXF4amxXcGNDWlA0bk5XXzE3ODYwOTE5ODc6MTc4NjA5NTU4N19WNA&amp;add_watermark=true&amp;scene_type=CCM\" alt=\"\"\/><\/figure>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-1 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\">\n<h2 class=\"wp-block-heading\"><\/h2>\n<\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83e\udded<mark style=\"background-color:rgba(0, 0, 0, 0);color:#178819\" class=\"has-inline-color\">Start Your Material Choice Here<\/mark><\/h2>\n\n\n\n<p>Base Material is the first field you set on the Seeed Fusion order page. <strong>It shapes how your board handles heat, mechanical structure, bending, and high-frequency signals<\/strong> \u2014 and it determines the layer counts, thicknesses, surface finishes, and processes available later.<\/p>\n\n\n\n<p>The most reliable way to choose is to start from your product. Confirm four things first: its operating temperature and power, how tight the internal space is, whether the board needs to bend, and how high its signal frequency runs.<\/p>\n\n\n\n<p>Seeed Fusion offers six base materials. <strong>Use the table below for a first pass<\/strong> \u2014 locate the type that matches your core need, then read that section for how to choose.<\/p>\n\n\n\n<figure class=\"wp-block-table is-style-stripes\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Base Material<\/strong><\/td><td><strong>Key Characteristic<\/strong><\/td><td><strong>Common Applications<\/strong><\/td><td class=\"has-text-align-left\" data-align=\"left\"><strong>Options on Seeed Fusion<\/strong><\/td><\/tr><tr><td>FR-4<\/td><td>Mechanically stable; suits most general-purpose rigid PCBs<\/td><td>Prototypes, control boards, dev boards, general electronics<\/td><td class=\"has-text-align-left\" data-align=\"left\">TG130 \/ TG150 \/ TG170<\/td><\/tr><tr><td>Aluminum<\/td><td>Aluminum base helps carry heat away from the circuit<\/td><td>LED lighting, power supplies, heat-generating devices<\/td><td class=\"has-text-align-left\" data-align=\"left\">Aluminum<\/td><\/tr><tr><td>Flexible<\/td><td>Thin, light, and bendable; fits tight space and flexible interconnects<\/td><td>Wearables, camera modules, display connections, compact devices<\/td><td class=\"has-text-align-left\" data-align=\"left\">Flexible PCB<\/td><\/tr><tr><td>Rigid-Flex<\/td><td>Combines rigid and flexible sections in one board<\/td><td>Space-constrained, structurally complex, highly integrated products<\/td><td class=\"has-text-align-left\" data-align=\"left\">Rigid-Flex PCB<\/td><\/tr><tr><td>High Frequency<\/td><td>Low dielectric loss; stable electrical performance at high frequencies<\/td><td>RF, microwave, wireless communication, high-frequency circuits<\/td><td class=\"has-text-align-left\" data-align=\"left\">Rogers RO4003C \/ RO4350B<\/td><\/tr><tr><td>Copper<\/td><td>Copper base for high-power, high-heat designs<\/td><td>High-power LEDs, power electronics, concentrated-heat components<\/td><td class=\"has-text-align-left\" data-align=\"left\">Copper PCB<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-2 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\">\n<h2 class=\"wp-block-heading\"><\/h2>\n<\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">\u2705 <mark style=\"background-color:rgba(0, 0, 0, 0);color:#178819\" class=\"has-inline-color\">How to Choose the Right Base Material<\/mark><\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Most general-purpose rigid PCBs \u2192 <strong>FR-4<\/strong>, then pick TG130 \/ TG150 \/ TG170 by temperature and reliability<\/li>\n\n\n\n<li>The board needs to bend or fit a compact space \u2192 <strong>Flexible<\/strong><\/li>\n\n\n\n<li>Rigid sections and flexible connections must be integrated \u2192 <strong>Rigid-Flex<\/strong><\/li>\n\n\n\n<li>RF, microwave, wireless, or signal-sensitive circuits \u2192 <strong>High Frequency<\/strong>, then compare RO4003C and RO4350B<\/li>\n\n\n\n<li>Heat dissipation is the main concern \u2192 <strong>Aluminum<\/strong><\/li>\n\n\n\n<li>High power with concentrated heat \u2192 <strong>Copper<\/strong><\/li>\n<\/ul>\n\n\n\n<p>The sections below explain each material in more detail.<\/p>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-3 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\">\n<h2 class=\"wp-block-heading\"><\/h2>\n<\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">1\ufe0f\u20e3<mark style=\"background-color:rgba(0, 0, 0, 0);color:#178819\" class=\"has-inline-color\">FR-4: The General-Purpose Choice for Most Rigid PCBs<\/mark><\/h2>\n\n\n\n<p><strong>FR-4 is the most common rigid <\/strong><strong>PCB<\/strong><strong> base material \u2014 woven glass fabric bonded with epoxy resin.<\/strong> It&#8217;s a solid starting point for control boards, sensor boards, dev boards, consumer electronics, and general industrial electronics.<\/p>\n\n\n\n<p>Fusion&#8217;s FR-4 comes in three Material Types that differ by Tg \u2014 the Glass Transition Temperature, the range where the material&#8217;s mechanical and dimensional properties begin to change noticeably. <strong>A higher Tg generally means better stability under heat and repeated thermal cycling.<\/strong><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>TG130<\/strong> \u2014 general operating conditions and typical prototypes.<\/li>\n\n\n\n<li><strong>TG150<\/strong> \u2014 projects with higher temperature or better thermal stability requirements.<\/li>\n\n\n\n<li><strong>TG170<\/strong> \u2014 designs with high thermal stress, complex structure, or stricter reliability needs.<\/li>\n<\/ul>\n\n\n\n<p>\ud83d\udca1 Tg is not the maximum operating temperature of the finished PCB. Most projects can start from standard Tg; move to a higher Tg when the product involves elevated operating temperatures, complex multilayer builds, higher soldering thermal stress, or stricter reliability requirements.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img fetchpriority=\"high\" decoding=\"async\" width=\"1030\" height=\"447\" src=\"https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-28-1030x447.png\" alt=\"\" class=\"wp-image-131334\" srcset=\"https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-28-1030x447.png 1030w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-28-300x130.png 300w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-28-768x333.png 768w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-28-1536x667.png 1536w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-28-32x14.png 32w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-28-1024x444.png 1024w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-28.png 1919w\" sizes=\"(max-width: 1030px) 100vw, 1030px\" \/><\/figure>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-4 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\">\n<h2 class=\"wp-block-heading\"><\/h2>\n<\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">2\ufe0f\u20e3<mark style=\"background-color:rgba(0, 0, 0, 0);color:#178819\" class=\"has-inline-color\">Aluminum: When You Need Better Thermal Management<\/mark><\/h2>\n\n\n\n<p><strong>Aluminum <\/strong><strong>PCB<\/strong><strong> uses an aluminum base to carry heat away from the circuit area.<\/strong> Consider it first when heat concentration is the main challenge, or when components need the PCB to move heat toward an enclosure or heat-dissipating structure.<\/p>\n\n\n\n<p>\ud83d\udca1 Actual thermal performance also depends on the insulating layer, copper weight, board thickness, layout, and overall enclosure cooling, so evaluate it as part of the full thermal design.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img decoding=\"async\" width=\"1030\" height=\"415\" src=\"https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-29-1030x415.png\" alt=\"\" class=\"wp-image-131335\" srcset=\"https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-29-1030x415.png 1030w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-29-300x121.png 300w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-29-768x310.png 768w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-29-1536x619.png 1536w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-29-32x13.png 32w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-29-1024x413.png 1024w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-29.png 2029w\" sizes=\"(max-width: 1030px) 100vw, 1030px\" \/><\/figure>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-5 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\">\n<h2 class=\"wp-block-heading\"><\/h2>\n<\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">3\ufe0f\u20e3<mark style=\"background-color:rgba(0, 0, 0, 0);color:#178819\" class=\"has-inline-color\">Flexible: For Bending and Compact Designs<\/mark><\/h2>\n\n\n\n<p><strong>Flexible <\/strong><strong>PCB<\/strong><strong> (<\/strong><strong>FPC<\/strong><strong>) uses a thin, bendable base material that can fold along the internal structure of a product<\/strong> \u2014 connecting modules in tight spaces and reducing cable use. It&#8217;s common in wearables, camera modules, display assemblies, and other weight- or space-sensitive products.<\/p>\n\n\n\n<p>\ud83d\udca1 Before choosing Flexible, settle one question: <strong>does the board bend once during assembly and then stay fixed, or does it flex repeatedly in use?<\/strong> The two place different demands on routing, bend areas, copper design, and reliability, so confirming this early smooths later configuration and communication.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img decoding=\"async\" width=\"1030\" height=\"447\" src=\"https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-30-1030x447.png\" alt=\"\" class=\"wp-image-131336\" srcset=\"https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-30-1030x447.png 1030w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-30-300x130.png 300w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-30-768x333.png 768w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-30-1536x667.png 1536w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-30-32x14.png 32w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-30-1024x444.png 1024w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-30.png 1919w\" sizes=\"(max-width: 1030px) 100vw, 1030px\" \/><\/figure>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-6 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\">\n<h2 class=\"wp-block-heading\"><\/h2>\n<\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">4\ufe0f\u20e3<mark style=\"background-color:rgba(0, 0, 0, 0);color:#178819\" class=\"has-inline-color\">Rigid-Flex: Integrating Rigid Circuits with Flexible Connections<\/mark><\/h2>\n\n\n\n<p><strong>Rigid-Flex <\/strong><strong>PCB<\/strong><strong> combines rigid and flexible sections in one board:<\/strong> the rigid part carries components, the flexible part connects circuit areas \u2014 cutting out separate connectors, cables, and the assembly steps between multiple boards. It suits products that are space-constrained, structurally complex, or need higher interconnect integration.<\/p>\n\n\n\n<p>\u2699\ufe0f Because one board contains both rigid circuitry and FPC, <strong>ordering requires two separate parameter sets \u2014 Rigid Parameters and FPC Parameters<\/strong> (each with its own layer count, thickness, copper weight, and so on) \u2014 configured through <strong>Advanced <\/strong><strong>PCB<\/strong><strong>\/PCBA<\/strong>.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1030\" height=\"447\" src=\"https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-31-1030x447.png\" alt=\"\" class=\"wp-image-131337\" srcset=\"https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-31-1030x447.png 1030w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-31-300x130.png 300w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-31-768x333.png 768w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-31-1536x667.png 1536w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-31-32x14.png 32w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-31-1024x444.png 1024w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-31.png 1919w\" sizes=\"(max-width: 1030px) 100vw, 1030px\" \/><\/figure>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-7 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\">\n<h2 class=\"wp-block-heading\"><\/h2>\n<\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">5\ufe0f\u20e3<mark style=\"background-color:rgba(0, 0, 0, 0);color:#178819\" class=\"has-inline-color\">High Frequency: For RF, Microwave, and Signal-Sensitive Designs<\/mark><\/h2>\n\n\n\n<p>As signal frequency rises, the dielectric loss of ordinary base materials affects signal integrity, impedance control, and transmission more noticeably. <strong>High Frequency<\/strong><strong>PCB<\/strong><strong> uses materials with more stable dielectric properties and lower loss<\/strong>, suited to RF, microwave, antenna, and wireless communication circuits.<\/p>\n\n\n\n<p>Fusion offers two Material Types, Rogers RO4003C and RO4350B, both from the Rogers RO4000 series. <strong>They are glass-reinforced hydrocarbon and ceramic laminates (not PTFE)<\/strong>, can be fabricated with processes close to those for standard epoxy\/glass materials, and are lead-free process compatible.<\/p>\n\n\n\n<figure class=\"wp-block-table is-style-stripes\"><table class=\"has-fixed-layout\"><tbody><tr><td><strong>Material Type<\/strong><\/td><td><strong>Process Dk @ 10 GHz<\/strong><\/td><td><strong>Df @ 10 GHz<\/strong><\/td><td><strong>Main Point<\/strong><\/td><\/tr><tr><td>Rogers RO4003C<\/td><td>3.38 \u00b1 0.05<\/td><td>0.0027<\/td><td>Lower dielectric loss; suits circuits sensitive to high-frequency performance<\/td><\/tr><tr><td>Rogers RO4350B<\/td><td>3.48 \u00b1 0.05<\/td><td>0.0037<\/td><td>UL 94 V-0 flame rating and good dimensional stability<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>\ud83d\udca1 In plain terms: <strong>Dk (dielectric constant) affects impedance, signal propagation speed, and circuit size; a lower Df (dissipation factor) generally means less high-frequency loss.<\/strong> The right type depends on your operating frequency, impedance, stack-up, board thickness, and certification needs together. For full parameters, see the Data Sheet link under the High Frequency option on the order page.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1030\" height=\"460\" src=\"https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-32-1030x460.png\" alt=\"\" class=\"wp-image-131338\" srcset=\"https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-32-1030x460.png 1030w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-32-300x134.png 300w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-32-768x343.png 768w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-32-1536x687.png 1536w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-32-2048x916.png 2048w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-32-32x14.png 32w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-32-1024x458.png 1024w\" sizes=\"(max-width: 1030px) 100vw, 1030px\" \/><\/figure>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-8 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\">\n<h2 class=\"wp-block-heading\"><\/h2>\n<\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">6\ufe0f\u20e3<mark style=\"background-color:rgba(0, 0, 0, 0);color:#178819\" class=\"has-inline-color\">Copper: For High-Power, High-Heat Designs<\/mark><\/h2>\n\n\n\n<p><strong>Copper <\/strong><strong>PCB<\/strong><strong> uses a copper base and is positioned as High Power<\/strong> on the order page \u2014 for designs that need to move large amounts of heat, such as high-power LEDs, power conversion equipment, and power modules.<\/p>\n\n\n\n<p>Aluminum and Copper are both metal-core boards used to improve thermal management: <strong>evaluate Aluminum (positioned as Thermal) for common heat-dissipation needs, and Copper (positioned as High Power) for designs with higher power and heat.<\/strong> The final choice comes down to component power, heat distribution, insulation structure, and how the PCB connects to a heatsink or enclosure.<\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1030\" height=\"489\" src=\"https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-33-1030x489.png\" alt=\"\" class=\"wp-image-131339\" srcset=\"https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-33-1030x489.png 1030w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-33-300x143.png 300w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-33-768x365.png 768w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-33-1536x730.png 1536w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-33-2048x973.png 2048w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-33-32x15.png 32w, https:\/\/www.seeedstudio.com\/blog\/wp-content\/uploads\/2026\/08\/image-33-1024x486.png 1024w\" sizes=\"(max-width: 1030px) 100vw, 1030px\" \/><\/figure>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-10 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\">\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-9 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:100%\">\n<h2 class=\"wp-block-heading\"><\/h2>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n\n\n\n<h2 class=\"wp-block-heading\">\ud83d\ude80<mark style=\"background-color:rgba(0, 0, 0, 0);color:#178819\" class=\"has-inline-color\"> Ready to Order<\/mark><\/h2>\n\n\n\n<p>Material choice also works together with layer count, thickness, copper weight, surface finish, impedance, and special processes. <strong>Start standard projects from Standard <\/strong><strong>PCB<\/strong><strong>\/PCBA; use Advanced PCB\/PCBA for <\/strong><strong>HDI<\/strong><strong>, high layer counts, Rigid-Flex, <\/strong><strong>High Frequency<\/strong><strong>, and other special manufacturing needs.<\/strong><\/p>\n\n\n\n<p>If the material you need isn&#8217;t covered on the page yet, send your Gerber files and manufacturing requirements to <strong>fusion@seeed.io<\/strong> and the Fusion team will reply with a quote within two working days.<\/p>\n\n\n\n<p>\ud83d\ude80 <strong>Ready to go? Upload your <\/strong><strong>Gerber<\/strong><strong>, choose your Base Material, and start your <\/strong><strong>PCB<\/strong><strong> project \u2192<\/strong><a href=\"https:\/\/www.seeedstudio.com\/fusion_pcb.html?from=blog\">https:\/\/www.seeedstudio.com\/fusion_pcb.html?from=blog<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>\ud83e\uddedStart Your Material Choice Here Base Material is the first field you set on 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