{"id":15850,"date":"2017-07-03T16:11:29","date_gmt":"2017-07-03T08:11:29","guid":{"rendered":"http:\/\/www.seeedstudio.com\/blog\/?p=15850"},"modified":"2017-11-09T16:26:46","modified_gmt":"2017-11-09T08:26:46","slug":"pcb-lamination-structure","status":"publish","type":"post","link":"https:\/\/www.seeedstudio.com\/blog\/2017\/07\/03\/pcb-lamination-structure\/","title":{"rendered":"PCB Lamination Structure – PCB DFM Part 9"},"content":{"rendered":"

Layer Structure<\/h2>\n

[86]The foil stacking structure is recommended.
\nDescription: For PCB lamination, there are generally two design types: Copper foil structure and Core board
\nstructure. The Core board type is used in special multilayered boards and mixed boards.<\/p>\n

\"Layer<\/p>\n

Figure 53: PCB lamination types.<\/p>\n

 <\/p>\n

[87] 0.5oz copper foil is generally used for the copper in the outer layers, whereas 1oz copper foil is generally
\nchosen for the inner layers. Core boards with asymmetric thicknesses should be avoided in the inner layers.<\/p>\n

[88] Symmetrical design considerations include the thickness of pre-preg layers, the type of resin used, the
\nthickness of the copper foil and the type of layer distribution (copper foil layer, circuit layer). The layout
\nshould be as symmetrical as possible about the symmetry axis.<\/p>\n

\"Symmetrical<\/p>\n

Figure 54: Symmetrical design diagram<\/p>\n

If you’ve mastered the PCB lamination structure rules, take Seeed Fusion pcb prototyping<\/a> a try now!<\/p>\n

More Chapters:<\/strong><\/p>\n

1.\u00a0Brief Introduction<\/a>
\n2.\u00a0Seeed Fusion PCB Specification<\/a>
\n3.\u00a0Panelization and Bridge Design<\/a>
\n4.\u00a0Component Layout Considerations<\/a>
\n5.\u00a0PCB Hole design<\/a>
\n6.\u00a0Solder Mask Design<\/a>
\n7.\u00a0Copper Trace Design<\/a>
\n8.\u00a0Silkscreen Design<\/a>
\n10.\u00a0PCB Dimensions Specification<\/a>
\n11.\u00a0Fiducial Mark Design<\/a>
\n12.\u00a0Surface Treatment<\/a>
\n13.\u00a0Files for Manufacture Requirements<\/a>
\n14.\u00a0Appendix\u00a0<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

Layer Structure [86]The foil stacking structure is recommended. Description: For PCB lamination, there are generally<\/p>\n","protected":false},"author":40,"featured_media":15852,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_lmt_disableupdate":"","_lmt_disable":"","_price":"","_stock":"","_tribe_ticket_header":"","_tribe_default_ticket_provider":"","_tribe_ticket_capacity":"0","_ticket_start_date":"","_ticket_end_date":"","_tribe_ticket_show_description":"","_tribe_ticket_show_not_going":false,"_tribe_ticket_use_global_stock":"","_tribe_ticket_global_stock_level":"","_global_stock_mode":"","_global_stock_cap":"","_tribe_rsvp_for_event":"","_tribe_ticket_going_count":"","_tribe_ticket_not_going_count":"","_tribe_tickets_list":"[]","_tribe_ticket_has_attendee_info_fields":false,"iawp_total_views":0,"footnotes":""},"categories":[1],"tags":[4,648],"class_list":["post-15850","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","tag-pcb","tag-pcb-dfm"],"yoast_head":"\nPCB Lamination Structure - PCB DFM Part 9 - Latest News from Seeed Studio<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.seeedstudio.com\/blog\/2017\/07\/03\/pcb-lamination-structure\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"PCB Lamination Structure - PCB DFM Part 9 - Latest News from Seeed Studio\" \/>\n<meta property=\"og:description\" content=\"Layer Structure [86]The foil stacking structure is recommended. 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