{"id":15987,"date":"2017-08-08T15:37:07","date_gmt":"2017-08-08T07:37:07","guid":{"rendered":"http:\/\/www.seeedstudio.com\/blog\/?p=15987"},"modified":"2017-11-09T16:58:22","modified_gmt":"2017-11-09T08:58:22","slug":"files-for-manufacture-requirements","status":"publish","type":"post","link":"https:\/\/www.seeedstudio.com\/blog\/2017\/08\/08\/files-for-manufacture-requirements\/","title":{"rendered":"Files for Manufacture Requirements – PCB DFM 13"},"content":{"rendered":"

13.1 Naming Requirements for Assembly Files<\/strong>
\n[108] Requires board name, version, panelization description and version information.<\/p>\n

13.2 Naming Requirements for Stencil Layout Files<\/strong>
\n[109] Requires board name and version description.<\/p>\n

13.3 Naming and Content Requirements for Drill Files<\/strong>
\n[110] Requires board name, version, base material, surface treatment method, board thickness, the number
\nof layers, the arrangement of layers, diameters of drill holes, drill hole properties, dimensions with tolerances
\nand any other special requirements.<\/p>\n

Since you have learnt all rules, it’s time to find a PCB manufacturer<\/a>\u00a0to get your boards fabricated!<\/p>\n

More Chapters:<\/strong>
\n1.\u00a0Brief Introduction<\/a>
\n2.\u00a0Seeed Fusion PCB Specification<\/a>
\n3.\u00a0Panelization and Bridge Design<\/a>
\n4.\u00a0Component Layout Considerations<\/a>
\n5.\u00a0PCB Hole design<\/a>
\n6.\u00a0Solder Mask Design<\/a>
\n7.\u00a0Copper Trace Design<\/a>
\n8.\u00a0Silkscreen Design<\/a>
\n9.\u00a0PCB Lamination Structure<\/a>
\n10.\u00a0PCB Dimensions Specification<\/a>
\n11.\u00a0Fiducial Mark Design<\/a>
\n12.\u00a0Surface Treatment<\/a>
\n14.\u00a0Appendix\u00a0<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

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