{"id":24420,"date":"2019-10-11T00:32:10","date_gmt":"2019-10-10T16:32:10","guid":{"rendered":"\/blog\/?p=24420"},"modified":"2023-12-01T10:40:44","modified_gmt":"2023-12-01T02:40:44","slug":"new-detailed-production-status-updates-for-pcb-and-pcba","status":"publish","type":"post","link":"https:\/\/www.seeedstudio.com\/blog\/2019\/10\/11\/new-detailed-production-status-updates-for-pcb-and-pcba\/","title":{"rendered":"Seeed Fusion Introduces New Detailed Production Status Updates for PCB and PCBA"},"content":{"rendered":"\n
It\u2019s been on our to-do list for a long time and you\u2019ve\nconstantly been nagging at us to get it done – now it\u2019s finally online! We\u2019ve\nupgraded the PCB and PCB assembly order production statuses so you can have a\nbetter idea of how your order is coming along. Worried your order has gotten\nstuck? Taking a little longer than usual? Just log into your account, go to\nyour Order History and click for more details.<\/p>\n\n\n\n
*Please note that not all PCB orders (notably Premium and\nAdvanced orders), will have detailed production statuses, but that does not\nmean they are not being processed! If in doubt, ask our support team.<\/p>\n\n\n\n<\/figure>\n\n\n\n
PCB Production<\/strong><\/h3>\n\n\n\n
Now for the interesting bit. We\u2019ve broken down the PCB manufacture phase into 12-14 steps. To give you a better idea of what goes on at each stage, here\u2019s a brief introduction:<\/p>\n\n\n\n
Panel Preparation<\/strong><\/h4>\n\n\n\n
All boards begin as big sheets of FR4 fiberglass panels covered with copper foil on both sides (collectively known as a core). These get sliced up into manageable sizes – typically around about 40 by 50 cm panels and are then cleaned and pre-processed.<\/p>\n\n\n\n\nPCB cores come in big sheets<\/figcaption><\/figure>\n\n\n\nSmaller, easier to handle panels<\/figcaption><\/figure>\n<\/figure>\n\n\n\n
Inner Layer Etching<\/strong><\/h4>\n\n\n\n
(4+ layer boards only)<\/p>\n\n\n\n
For multi-layered boards, there are additional layers to\nprocess. The cores of the multi-layer board are etched first much in the same\nway as 2 layer boards to make the traces for the inner layers.<\/p>\n\n\n\n
Inner Layer AOI <\/strong><\/h4>\n\n\n\n
(4+ layer boards only)<\/p>\n\n\n\n
All inner layers undergo Automated Optical Inspection (AOI)\nto visually check the bare circuits for defects. It\u2019s important to fix these\nfirst as reworking the inner layers is impossible after the stack-up has been\nbuilt.<\/p>\n\n\n\n\nCopper repair<\/figcaption><\/figure>\n\n\n\nAOI machine<\/figcaption><\/figure>\n<\/figure>\n\n\n\n
Lamination <\/strong><\/h4>\n\n\n\n
(4+ layer boards only)<\/p>\n\n\n\n
Perhaps the most time-consuming step in the production of\nmulti-layer boards. The stack-up is constructed by sandwiching the core or\ncores, foils and prepreg layers together with strong epoxy glue. Multiple\nboards are then loaded into a large lamination press and exerted to high\ntemperatures and pressures for several hours to allow the epoxy to cure and\nharden.<\/p>\n\n\n\n
Drilling <\/strong><\/h4>\n\n\n\n
All the standard drill holes, including plated, non-plated\nholes and milling slots are drilled at this stage. The noisy thundering drill\nmachines automatically change drill bits and sense if a bit needs replacing. At\nthis stage, the freshly drilled holes do not have any copper plating.<\/p>\n\n\n\n\nNC drilling machines<\/figcaption><\/figure>\n\n\n\nDrill bits of many sizes<\/figcaption><\/figure>\n\n\n\nExhausted drill bits<\/figcaption><\/figure>\n<\/figure>\n\n\n\n
Drill Hole Plating<\/strong><\/h4>\n\n\n\n
The first plating stage. The entire panel is hung on rails\nand dipped into copper sulfate baths to build the initial layer of copper on\nthe walls of the holes. The thickness is only a fraction of the final copper\nthickness at this point.<\/p>\n\n\n\n\nThoroughly plated panels<\/figcaption><\/figure>\n\n\n\nBaths of bright blue copper sulfate<\/figcaption><\/figure>\n<\/figure>\n\n\n\n
Circuit Plating and Etching<\/strong><\/h4>\n\n\n\n
Several bathing, developing and etching steps are taken to build-up\non the thickness of the copper features and remove or etch away the unwanted\ncopper. Here the final desired copper thickness is achieved.<\/p>\n\n\n\n\nThe ‘dark room’<\/figcaption><\/figure>\n\n\n\nInspection after rinsing<\/figcaption><\/figure>\n\n\n\nPost photoresist developing and washing<\/figcaption><\/figure>\n<\/figure>\n\n\n\n
Outer Layer AOI<\/strong><\/h4>\n\n\n\n
Automated Optical Inspection for the outer layers.<\/p>\n\n\n\n
Solder Mask Application<\/strong><\/h4>\n\n\n\n
Solder mask (the main colored coating of the PCB) is applied\nusing silkscreen equipment. The boards are then baked to cure the solder mask.<\/p>\n\n\n\n
The name is rather misleading now since white silkscreen\ntext is now printed onto the boards using a specialized LaserJet ink printer. This\nonly takes a few seconds and is more accurate compared to the traditional\nsilkscreen method. (Black silkscreen ink is still applied using the traditional\nmethod).<\/p>\n\n\n
The boards are sent to have the chosen surface finish\napplied onto the exposed pads.<\/p>\n\n\n
\nHASL and ENIG coated panels<\/figcaption><\/figure><\/div>\n\n\n
In-Circuit Testing<\/strong><\/h4>\n\n\n\n
All electrical connections are checked via either flying\nneedle tests (for small quantities) or fixture testing (batch production). They\nare compared directly against the production files, that\u2019s why you won\u2019t find\nany shorts or broken circuits on your boards unless they originated in the\nfiles.<\/p>\n\n\n
\nHouse of flying needles <\/figcaption><\/figure><\/div>\n\n\n
Board Routing<\/strong><\/h4>\n\n\n\n
Time to free the boards from their panels. High-speed\nrouting machines cleanly mill out the pieces, and boards requiring v-cuts are\nloaded into the v-cut machine. Boards with a lot of milling or many v-cuts can take\nlonger to process.<\/p>\n\n\n\n\nV-cut machine<\/figcaption><\/figure>\n\n\n\nRouting\/Milling machine<\/figcaption><\/figure>\n<\/figure>\n\n\n\n
Quality Checking<\/strong><\/h4>\n\n\n\n
The boards are cleaned and meticulously inspected for\ndefects such as board warpage, blisters, solder mask ripple, exposed copper\nedges, faded printing. After discarding defective pieces, the technicians count\nif there are a sufficient number of acceptable pieces left. If not, then they\nmay need to produce another batch from scratch \u2639.<\/p>\n\n\n\n\nMeticulously checking every board<\/figcaption><\/figure>\n\n\n\nVaccum bubble-wrap packaging<\/figcaption><\/figure>\n<\/figure>\n\n\n\n
Think you know your stuff? Test your knowledge on the PCB\nproduction process!<\/strong><\/h3>\n\n\n\n
Highlight the white spaces to reveal the answers <\/p>\n\n\n\n
How many copper plating stages are there?<\/strong><\/h4>\n\n\n\n
Two:\none to give the plated through holes and vias a little copper covering and one to\nattain the desired final thickness.<\/em><\/p>\n\n\n\n
If the copper layers in the core are 0.5oz thick (each side), and 1oz is the desired copper weight, roughly, what is the thickness of the copper walls of plated through holes?<\/strong><\/h4>\n\n\n\n
>0.5oz, made up of the initial thinner plating and the final plating of the entire board. The actual value is greater and depends on the dimensions of the hole since a smaller area results in greater copper deposition.<\/em><\/p>\n\n\n\n
In a standard production process for multi-layer boards, why is the copper weight in the inner layers thinner than the outer layers? What can be done to achieve the same or heavier copper weight for the inner layers?<\/strong><\/h4>\n\n\n\n
Typically,\nthere is no plating step for the inner layers so the final thickness is the\nsame as the foil thickness of the core, normally 0.5oz. If more copper is\nneeded, one could add another plating step and\/or start with a core with a heavier\ncopper foil.<\/em><\/p>\n\n\n\n
How many sets (top and bottom) of photoimageable films have to be made for a typical 2 layer board?<\/strong><\/h4>\n\n\n\n
Two or three, depending on whether or not the inkjet or silkscreen method is used for the silkscreen.<\/em> One set for copper etching, solder mask application and silkscreen,<\/em> <\/p>\n\n\n\n
At what stage are non-plated holes made?<\/strong><\/h4>\n\n\n\n
At\nthe drilling stage of course. All drill holes, whether plated or non-plated,\nare drilled together in one stage. The only difference after that is that all holes\ndestined to be plated are exposed in the LPI film and non-plated holes remain\ncovered up.<\/em><\/p>\n\n\n\n
That\u2019s all for now. Keep an eye out on your order statuses and stay tuned for next time when we\u2019ll explain the PCBA production steps in more detail.<\/p>\n","protected":false},"excerpt":{"rendered":"
It\u2019s been on our to-do list for a long time and you\u2019ve constantly been nagging<\/p>\n","protected":false},"author":197,"featured_media":25098,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_lmt_disableupdate":"","_lmt_disable":"","_price":"","_stock":"","_tribe_ticket_header":"","_tribe_default_ticket_provider":"","_tribe_ticket_capacity":"0","_ticket_start_date":"","_ticket_end_date":"","_tribe_ticket_show_description":"","_tribe_ticket_show_not_going":false,"_tribe_ticket_use_global_stock":"","_tribe_ticket_global_stock_level":"","_global_stock_mode":"","_global_stock_cap":"","_tribe_rsvp_for_event":"","_tribe_ticket_going_count":"","_tribe_ticket_not_going_count":"","_tribe_tickets_list":"[]","_tribe_ticket_has_attendee_info_fields":false,"iawp_total_views":0,"footnotes":""},"categories":[4705],"tags":[1101,1100,132],"class_list":["post-24420","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-seeed-studio-fusion","tag-pcb-factory","tag-pcb-manufacture","tag-fusion"],"yoast_head":"\n
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