
| Item | Specification |
|---|---|
| Product Versions | |
| Product | XIAO STM32C5 XIAO STM32C5 (Pre-Soldered) |
| Processor & Memory | |
| Microcontroller | STMicroelectronics STM32C5A3CG |
| CPU | Single-core Arm Cortex-M33, up to 144 MHz, with FPU and DSP instructions |
| Internal program Flash | 1 MB |
| SRAM | 256 KB |
| External Flash | 16 MB |
| External clock | Onboard 48 MHz HSE crystal with ±10 ppm initial frequency tolerance |
| CAN FD Connectivity | |
| CAN Interface | 2 native FDCAN interfaces |
| Onboard CAN transceiver | 1 × TI TCAN3403-Q1 |
| Onboard CAN bus connection | CANH/CANL pads; use board GND as the signal reference |
| Second CAN channel | Digital TX/RX signals External CAN transceiver required |
| CAN termination | 120 Ω, enabled by default Disconnectable through a cuttable solder link |
| IMU & Temperature Control | |
| IMU | STMicroelectronics LSM6DS3TR-C, 3-axis accelerometer and 3-axis gyroscope |
| IMU heating | Dedicated heating resistors around the IMU with GPIO-controlled drive |
| Temperature regulation | Programmable warm-up Closed-loop setpoint regulation requires temperature feedback and suitable application firmware |
| Interfaces & Power | |
| USB | USB-C USB 2.0 Full Speed, 12 Mbps signaling rate |
| Logic level | 3.3 V |
| Power | USB-C 5 V input Lithium battery through BAT pads |
| Battery charging | Onboard charging circuit |
| Debug interface | SWD |
| Controls & Form Factor | |
| User button | Reset button Boot button |
| Indicators | User LED Charging LED |
| Form factor | Compact XIAO module with castellated edge pads |
Seeed Studio XIAO ESP32-S3 Plus | x1 |
Antenna | x1 |
7 Pin Header | x2 |
Seeed Studio XIAO ESP32-S3 Plus, powered by ESP32-S3's 240MHz Xtensa 32-bit LX7 dual-core processor, brings more SMD pins to the tiny versatile XIAO ESP32-S3. While maintaining all the powerful features including WiFi and BLE 5.0 wireless connectivities and 2.4GHz Rod antenna, the Plus variant features redesigned castellations and pad layout on the back, offering 9 additional GPIOs specifically for advanced Bluetooth projects requiring expanded I/Os via SMD board-to-board soldering. It's ideal for advanced IoT projects, Smart Homes, and professional wireless devices requiring extra I/O connectivity.