The HiKey 960 is powered by the latest Kirin 960 SoC with four ARM® Cortex®-A73 CPUs (up to 2.3GHz) and four ARM Cortex-A53 CPUs (up to 1.8GHz) configured according to the big.LITTLE™ architecture.
This item is no longer available, please consider the 4G RAM Version as a replacement.
The HiKey 960 is powered by the latest Kirin 960 SoC with four ARM Cortex-A73 CPUs (up to 2.3GHz) and four ARM Cortex-A53 CPUs (up to 1.8GHz) configured according to the big.LITTLE architecture. The integrated Mali™-G71 MP8 GPU in the Kirin 960 SoC gives the HiKey 960 high-performance image processing abilities. With 3GB LPDDR4 memory and 32GB UFS flash on board, the HiKey 960 can be used for most embedded applications.
The HiKey 960 has updated the USB Type-A host from USB2.0 to USB3.0 compared to the original HiKey board. In order to enhance the expansion ability, the HiKey 960 includes a PCI-E Gen2 on M.2 M Key connector to enable PCI-E device connection. The HiKey 960 also includes an updated WiFi module supporting 2.4GHZ single band to 2.4- and 5.0GHz dual-band with two antennas.
Android support for the HiKey 960 will be enabled through the Android Open Source Project (AOSP). Additional software support will be added through collaboration between Huawei, Linaro and the community.
40 pin low speed expansion connector: +1.8V, +5V, DC power, GND, 2*UART, 2*I2C, SPI, I2S, 12*GPIO60 pin high speed expansion connector: 4L-MIPI DSI, I2C x2, SPI (48M), USB 2.0, 2L+4LMIPI CSI
|Storage||32GB UFS flash storage
MicroSD card slot (SD3.0, SDR104, up to 2TB)
|PCI-E||PCI-E Gen2 on M.2 M Key connector|
WiFi (2.4- and 5-GHz dual-band with two antennas)
|USB||2 x USB 3.0 type A (host mode only)
1 x USB 2.0 type C OTG
1 x HDMI 1.4 (Type A - full, up to FHD 1080P)
1 x 4L-MIPI DSI (Supports up to 3840 * 2400 @ 60Hz dual MIPI DSI interface LCD screen)
4K @30fps H.265/H264 video hardware encoder
H265\HEVC MP/High Tier, Main/High Tier, H.264 BP/MP/HP, MPEG 1/2/4, VC-1, VP6/8, RV8/9/10, DIVX, H265 up to 4K @60fps video hardware decoder
1 x Tensilica HiFi3.0 DSP audio subsystem
|Camera||1 x 4-lane MIPI CSI
1 x 2-lane MIPI CSI
|Expansion Interface||40 pin low speed expansion connector: +1.8V, +5V, DC power, GND, 2*UART, 2*I2C, SPI, I2S, 12*GPIO
60 pin high speed expansion connector: 4L-MIPI DSI, I2C x2, SPI (48M), USB 2.0, 2L+4LMIPI CSI
|LED||1 x WiFi activity LED（Yellow）
1 x BT activity LED (Blue)
4 x User LEDs (Green)
|Button||Power Button ： Button Power on/off & Reset the system|
|Power Source||Recommend a 12V@2A adapter with a DC plug which has a 4.75mm outer diameter and 1.7mm center pin with standard center-positive (EIAJ-3 Compliant)|
|Dimensions||0mm x0mm x0mm|
|SoC||Kirin 960 SoC|
|CPU||4*Cortex A73 (up to 2.3GHz) + 4*Cortex A53 (up to 1.8GHz) Big.LILLTE CPU architecture|
|GPU||ARM Mali G71 MP8, up to 900MHz|
|RAM||3GB LPDDR4 SDRAM @ 1866MHz|
|PMU||Hi6421GWCV530 Hi6422GWCV211 Hi6422GWCV212|
|Sizes||85mm x 55mm|
|HiKey 960 Development Board||1|