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A kit with (almost) everything you need to reball your first BGA chip! Includes the exact brands and tools used by Hacker Camp Shenzhen to teach BGA reballing at a mobile phone repair school. Accompanies the Hacker Camp Shenzhen 2014 BGA workshop video from Dangerous Prototypes.
Packing List:
  • Recycled mobile phone (chip donor)
  • Solder paste
  • Flux
  • Spatula
  • Tweezers right angle (ST-15)
  • Tweezers sharp (ST-11)
  • Knife and flat blade
  • BGA stencil
  • PCB holder
  • Screw driver
  • Phone opening tools
  • Cotton sticks
  • Dangerous Prototypes stickers

​You will need to bring your own (B.Y.O.):

  • Soldering iron (any will work)
  • Hot air rework station
  • Acetone (or nail polish remover)
  • Tissues
More information about the product, please click here.

Technical details

Dimensions 270mm x165mm x50mm
Weight G.W 506g
Battery Exclude


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