BGA Reballing Practice Kit
A kit with (almost) everything you need to reball your first BGA chip! Includes the exact brands and tools used by Hacker Camp Shenzhen to teach BGA reballing at a mobile phone repair school. Accompanies the Hacker Camp Shenzhen 2014 BGA workshop video from Dangerous Prototypes.
Packing List:
- Recycled mobile phone (chip donor)
- Solder paste
- Flux
- Spatula
- Tweezers right angle (ST-15)
- Tweezers sharp (ST-11)
- Knife and flat blade
- BGA stencil
- PCB holder
- Screw driver
- Phone opening tools
- Cotton sticks
- Dangerous Prototypes stickers
You will need to bring your own (B.Y.O.):
- Soldering iron (any will work)
- Hot air rework station
- Acetone (or nail polish remover)
- Tissues
More information about the product, please click here.
Technical details
| Dimensions | 270mm x165mm x50mm |
| Weight | G.W 506g |
| Battery | Exclude |
ECCN/HTS
| HSCODE |
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