10.1 Manufactured PCB Dimensions
 The range of dimensions allowed for each type of PCB construction is shown in table 11.
Figure 55: PCB dimensions description.
Table 11: PCB dimensions and weight requirements.
 Required PCB width-to-thickness ratio = Y / Z 150.
 Required PCB length-to-width ratio = X / Y 2.
 For board thicknesses of less than 0.8mm, the copper foil of should be evenly distributed to prevent board bending. If there are many small boards, use of a fixture is recommended.
 If the primary side does not meet the clearance area requirements, then the addition of a margin of a width
greater than 5mm, along the direction of travel is recommended.
Figure 56: PCB minimum margin dimensions.
 The body of components must not exceed past the edge of the PCB, and must satisfy the following:
The minimum distance from the edge of the solder pad (or component body) to the primary side
must be less than 5mm.
For non-reflow soldering, when a component protrudes out from the PCB, the width of the margin
is as follows:
Figure 57: Protruding component margin requirements.
For non-reflow soldering, when a component protrudes out from the PCB, the component must fit
into the margin with 0.5mm clearance as shown in Figure 58.
Figure 58: Protruding component margin gap requirements.
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